OFweek Display News: From April 10th to 12th, the second China Electronic Information Expo (CITE 2014) was held in Shenzhen Convention and Exhibition Center. As a leader in the field of flat panel display in China, Tianma Microelectronics focused on the latest progress in cutting-edge technologies such as LTPS, AM-OLED, and touch integration over the past year. According to industry observations, ultra-high PPI display technology and embedded touch technology will lead the new trend of 4G development.
In terms of small and medium-sized LTPS technology that has attracted much attention from the industry, Tianma, which has the first 5.5-generation LTPS production line in China, exhibited for the first time two products of 5.5" WQHD and 6.0" WQHD with ultra-high pixel densities of 537PPI and 490PPI. Its resolution is as high as 1440*2560, which pushes the quality level of the mobile phone screen to the extreme, and has technical advantages such as low power consumption, ultra-thin, and narrow frame, and has reached the world's leading level. Tianma exhibited two tablet products at the same time, 9" WQXGA and 10.1" WQXGA, with a resolution of 2560*1600 and a PPI of 335 and 296.
In terms of AM-OLED technology, Tianma's 5.5-generation AM-OLED production line has been officially put into construction, and a series of new products have also been exhibited this time. One of the products with 4.3" AM-OLED and ON-CELL combines the advantages of OLED and ON-CELL with brilliant color difference, high contrast, strong anti-interference ability, and ultra-thin.
In terms of touch integration, the embedded touch screen technology independently researched and developed by Tianma has reached the international advanced level. A 5"HD IN-CELL product was exhibited for the first time, which combines the integrated embedded touch control with high-resolution SFT technology, and has the advantages of wide viewing angle, high resolution, and multi-touch support. The product also won the "2014 CITE Innovative Product and Application Award" at the conference.